Kingbali 30W/m.k high performance thermal conductive adhesive glue

CAS No.:

7085-85-0

Other Names:

Thermal Conductive Glue

EINECS No.:

210-898-8

Place of Origin:

China

Classification:

Double Components Adhesives

Main Raw Material:

Silicone

Usage:

Construction, Fiber & Garment, Footwear & Leather, Packing, Transportation, Woodworking, COB/photovoltaic/semiconductor

Brand Name:

Kingbali

Model Number:

1901B Series

Type:

Two Component

Color:

White,Brown

Viscosity:

100~200 Pa.S

Mixing Ratio:

A:B=1:1(Volume)

Operation:

1~1.5Hrs(25 Degree)

Dielectric Constant:

2~4

Cure Time Completely:

2.5~8Hrs(15 Degree)